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MS Signs Semiconductor Company For Next Xbox

Xbox

7th April 2004, 9:34am
In a joint agreement today Microsoft has teamed up with Taiwan Semiconductor Manufacturing Company, which will see TSMC provide the semiconductor manufacturing services for future xbox products. This agreement will allow Microsoft have access to TSMC's advanced semiconductor process technologies.

The Manufacturing Pact Gives Microsoft Access to Advanced Nexsys Technology for SoC. According to the official site the first under this platform is the company's 90-nm technology with increased performance by two-times.
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by Robert Gardner